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BGAE540-Series from SMART Modular Technologies

With the BGAE540 series, SMART Modular Technologies offers a variety of eMMC in different designs, such as SP9M or SP9Q, . Please contact us if a component is not listed or if you are looking for an alternative or need a customized solution.
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SP9MAGP3AMI01
SP9MAGP3AMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 16GB | 153-ball
Datasheet requestSP9MAGP3AMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 16GB
Write Performance: 15 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
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SP9MAGP3AMI11
SP9MAGP3AMI11
SMART Modular Technologies
BGAE540 | eMMC 5.1 | pSLC | 5GB | 153-ball
Datasheet requestSP9MAGP3AMI11 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: pSLC
Interface: eMMC 5.1
Capacity: 5GB
Write Performance: 140 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
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SP9MAGP3BMI01
SP9MAGP3BMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 16GB | 153-ball
Datasheet requestSP9MAGP3BMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 16GB
Write Performance: 15 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
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SP9MBGP3AMI01
SP9MBGP3AMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 32GB | 153-ball
Datasheet requestSP9MBGP3AMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 32GB
Write Performance: 15 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
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SP9MBGP3AMI11
SP9MBGP3AMI11
SMART Modular Technologies
BGAE540 | eMMC 5.1 | pSLC | 10GB | 153-ball
Datasheet requestSP9MBGP3AMI11 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: pSLC
Interface: eMMC 5.1
Capacity: 10GB
Write Performance: 140 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MBGP3BMI01
SP9MBGP3BMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 32GB | 153-ball
Datasheet requestSP9MBGP3BMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 32GB
Write Performance: 15 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MBGP3BMI11
SP9MBGP3BMI11
SMART Modular Technologies
BGAE540 | eMMC 5.1 | pSLC | 10GB | 153-ball
Datasheet requestSP9MBGP3BMI11 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: pSLC
Interface: eMMC 5.1
Capacity: 10GB
Write Performance: 140 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MCGP3AMI01
SP9MCGP3AMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 64GB | 153-ball
Datasheet requestSP9MCGP3AMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 64GB
Write Performance: 25 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MCGP3AMI11
SP9MCGP3AMI11
SMART Modular Technologies
BGAE540 | eMMC 5.1 | pSLC | 20GB | 153-ball
Datasheet requestSP9MCGP3AMI11 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: pSLC
Interface: eMMC 5.1
Capacity: 20GB
Write Performance: 250 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MCGP3BMI01
SP9MCGP3BMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 64GB | 153-ball
Datasheet requestSP9MCGP3BMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 64GB
Write Performance: 25 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MDGP3AMI01
SP9MDGP3AMI01
SMART Modular Technologies
BGAE540 | eMMC 5.1 | 3D TLC | 128GB | 153-ball
Datasheet requestSP9MDGP3AMI01 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: 3D TLC
Interface: eMMC 5.1
Capacity: 128GB
Write Performance: 45 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
SP9MDGP3AMI11
SP9MDGP3AMI11
SMART Modular Technologies
BGAE540 | eMMC 5.1 | pSLC | 40GB | 153-ball
Datasheet requestSP9MDGP3AMI11 PDF Anfragen
Manufacturer SMART Modular Technologies
Series: BGAE540
Form Factor: 153-ball
Memory Type: pSLC
Interface: eMMC 5.1
Capacity: 40GB
Write Performance: 275 MB/s
Read Performance: 340 MB/s
Operating Voltage: 2,7-3,6 V
Industrie: Yes
Hi-Rel: Yes
Length: 11.5 mm
Width: 13 mm
Heigth: 1 mm
Min. operating temperature: -40 °C
Max. operating temperature: 85 °C
Models: SP9M
Merkzettel DETAILS Details
Request Anfrage
Hint: current revision of the supplier datasheet is applicable

Design-In Support

Do you have questions about the BGAE540-Series from SMART Modular Technologies or are you looking for alternatives? As an authorized distributor, we maintain a very close exchange with SMART Modular Technologies and are happy to advise you with our many years of experience in the selection of suitable components and possible adaptations. Please contact us!
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