AS4C-Series from Alliance Memory

With the AS4C series, Alliance Memory offers a variety of DDR1 SDRAM Memory ICs in different designs, such as AS4C64M16D1A or AS4C64M8D1, . Please contact us if a component is not listed or if you are looking for an alternative or need a customized solution.

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DDR1 SDRAM Chip | 128 Mb | 166 MHz | 2,5 VCC

DDR1 SDRAM Chip | 16 Mb | 200 MHz | 2,5 VCC

DDR1 SDRAM Chip | 256 Mb | 166 MHz | 1,8 VCC

DDR1 SDRAM Chip | 512 Mb | 200 MHz | 1,8 VCC

DDR1 SDRAM Chip | 2 Mb | 200 MHz | 2,5 VCC

DDR1 SDRAM Chip | 32 Mb | 200 MHz | 2,5 VCC

DDR1 SDRAM Chip | 512 Mb | 200 MHz | 1,8 VCC

DDR1 SDRAM Chip | 1000 Mb | 200 MHz | 1,8 VCC

DDR1 SDRAM Chip | 32 Mb | 200 MHz | 2,5 VCC

DDR1 SDRAM Chip | 4 Mb | 200 MHz | 2,5 VCC

Design-In Support

Do you have questions about the AS4C-Series from Alliance Memory or are you looking for alternatives? As an authorized distributor, we maintain a very close exchange with Alliance Memory and are happy to advise you with our many years of experience in the selection of suitable components and possible adaptations. Please contact us!

☎ +49 9135 7366665

Manufacturer	Alliance Memory
Density:	128 MBit
Organisation:	8D1
Frequency:	166 MHz
VCC:	2,5
DryPack:	Yes
MSL Level:	3
Mobile:	No
Chassis:	66pin TSOP II
Min. operating temperature:	-40 °C
Max. operating temperature:	85 °C
Models:	AS4C128M8D1

Manufacturer	Alliance Memory
Density:	16 MBit
Organisation:	16D1
Frequency:	200 MHz
VCC:	2,5
DryPack:	Yes
MSL Level:	3
Mobile:	No
Chassis:	60ball TFBGA
Min. operating temperature:	-40 °C
Max. operating temperature:	85 °C
Models:	AS4C16M16D1

Manufacturer	Alliance Memory
Density:	16 MBit
Organisation:	16D1A
Frequency:	200 MHz
VCC:	2,5
DryPack:	Yes
MSL Level:	3
Mobile:	No
Chassis:	66pin TSOP II
Min. operating temperature:	-40 °C
Max. operating temperature:	85 °C
Models:	AS4C16M16D1A

Manufacturer	Alliance Memory
Density:	256 MBit
Organisation:	16M x 16
Frequency:	166 MHz
VCC:	1,8
DryPack:	Yes
MSL Level:	3
Mobile:	No
Chassis:	60ball FBGA
Min. operating temperature:	-30 °C
Max. operating temperature:	85 °C
Models:	AS4C16M16MD1

Manufacturer	Alliance Memory
Density:	512 MBit
Organisation:	16M x 32
Frequency:	200 MHz
VCC:	1,8
DryPack:	Yes
MSL Level:	3
Mobile:	No
Chassis:	90ball FPBGA
Min. operating temperature:	-40 °C
Max. operating temperature:	85 °C
Models:	AS4C16M32MD1

Design-In Support

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