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Optik-D™ - The new Generation of Low Loss Optical Interconnects

Optik-D™ - The new Generation of Low Loss Optical Interconnects

The announced TOF-Time of Flight camera chip from the Swiss semiconductor manufacturer ESPROS Photonics AG offers higher performance and optimal application in various applications.

The TOF Chip with its size of 9.7mm x 8.7mm and 320 x 240 pixels (QVGA resolution) offers extensive application possibilities. The CSP (Chip Scale Package) results in a height of just 0.28 mm with a light-active area of 6.4mm x 4.8mm. This highly integrated component contains all control units relevant for control. The communication to the processor to be switched on is secured via a parallel, digital 12-bit video interface. The TOF chip is also ideally suited for mobile applications, as only a small number of external components are required. With a resolution in the millimeter range, measuring ranges of up to 100m can be achieved.

Besides the chip (epc660-CSP64), an evaluation kit consisting of hardware and software is offered. Comprehensive documentation is available for smooth system integration. The use of this innovative TOF camera chip is very variable, from person and gesture recognition as well as person counting, measurement of package volume, security applications in the robot and machine area, airfield recognition for helicopters and much more.

On our homepage you will find further information. Of course, we are also happy to advise you on how to handle the sensitive TOF chips.

Published: 4/7/2015

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