Neumüller signs distribution agreement with ESPROS Photonics AG

Neumüller Elektronik GmbH expands its product portfolio with the products of Swiss semiconductor manufacturer ESPROS Photonics AG. With their new process technology, extremely small package shapes can be realized in CS packages (chip-scale packages). Conventional packages are no longer necessary. This saves you, the customer, valuable space on your printed circuit board. The entire manufacturing process at ESPROS takes place at the wafer level, i.e. the sawing of the wafers produces ready-to-contact components that do not have to be placed on a lead frame and subjected to a bonding process. MSL processing times do not have to be taken into account, because no moisture can penetrate into the packages and thus no "popcorn effect" can occur during the soldering process.

The standard product portfolio includes photodiode arrays, components for light barriers, analog and digital transimpedance amplifier, outputdriver, CCD sensors and 3D Time-of-Flight Range Finder and 3D Time-of-Flight Image Sensors. Wafer production is currently taking place at the headquarters in Sargans. An expansion of the production capacity by the 'Mountain Fab' is in planning and the construction can be realized at short notice with corresponding volume applications.

Also to be emphasized is the range of customized solutions, which Neumüller also offers. As a joint team, tailor-made solutions can be realised in the field of optoelectronics. If desired, CCD and CMOS technology can be implemented on a monolithic chip. This possibility is unique worldwide. If you have your own design possibilities, you can also use the foundry service based on the ESPROS Photonic CMOS™ process. For this you receive support during the development process up to the finished product.