TOF Sensors

3D time-of-flight sensors from ESPROS are based on the light pulse travel time principle and enable precise distance and depth measurements. They are suitable for 3D sensing, robotics, industrial automation, medical technology and smart devices. Developers benefit from compact sensor solutions with high integration density, reproducible results and good suitability for series products.


EPC611-CSP24-001 TOF Sensor \| 8x8 Pixel	ESPROS Photonics Corporation	8x8 Pixel	550 ... 1000 nm	850 nm	0.03 mm²	SPI	No	2.7 mm	2.78 mm	0.25 mm	-40 °C	105 °C	CSP24	0.01 g
EPC635-CSP44-003 TOF Sensor \| 160x60 Pixel	ESPROS Photonics Corporation	160x60 Pixel	550 ... 1000 nm	850 nm	3.84 mm²	8 bit TCMI	No	6.26 mm	4.18 mm	0.24 mm	-40 °C	105 °C	CSP44	0.01 g
epc660 Board to Board connector PCB PCB für EPC660 mit Chip on Board	ESPROS Photonics Corporation	320x240 Pixel	550 ... 1000 nm	850 nm	30.72 mm²	12 bit parallel video	Yes	37.4 mm	25.4 mm	1.6 mm	-40 °C	105 °C	Steckverbinder§edge connector	0.03 g
EPC660 Card Edge Connector Carrier PCB für EPC660 mit Chip on Board	ESPROS Photonics Corporation	320x240 Pixel	550 ... 1000 nm	850 nm	30.72 mm²	12 bit parallel video	Yes	37.25 mm	36 mm	1.6 mm	-40 °C	105 °C	Steckverbinder§edge connector	0.03 g
EPC660-CSP68-011 320x240 Pixel TOF Imager Chip	ESPROS Photonics Corporation	320x240 Pixel	550 ... 1000 nm	850 nm	30.72 mm²	12 bit parallel video	No	9.7 mm	8.66 mm	0.24 mm	-40 °C	105 °C	CSP68	0.01 g
epc670 320x240 Pixel TOF Imager Chip	ESPROS Photonics Corporation	320x240 Pixel	550 ... 1000 nm	850 nm	30.72 mm²	MIPI CSI-2	No	11.7 mm	9.3 mm	0.27 mm	-40 °C	125 °C	CSP79	0.01 g
epc670-004-BC-001 320x240 Pixel TOF Imager on Chip Carrier	ESPROS Photonics Corporation	320x240 Pixel	550 ... 1000 nm	850 nm	30.72 mm²	MIPI CSI-2	Yes	38 mm	26 mm	6 mm	-40 °C	125 °C	CSP79	0.01 g

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Here you will find bundled information on the topic as well as selected brochures with further content, technical background information, and practical solutions.

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Time-of-Flight (ToF)

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